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Bessel cutting head

Precision material processing (such as glass, FPC/PCB, etc.), enabling efficient cutting of complex curves and thick materials.

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Details

Core Advantages:

High-precision Optical Design: The lens group optimizes the optical path to achieve excellent cutting effects.

Long-focus Deep Processing: The depth of focus can reach up to 13mm (under typical working conditions), making it suitable for processing thick materials.

High-damage-resistant Lenses: With a damage threshold of 12J/cm2, it supports the stable operation of picosecond/femtosecond lasers.

Parameter

Technical Parameters:

Wavelength: 1030-1070nm
Depth of Focus: 10mm (Input Spot Size: 12mm, Light Transmittance: 99%)
Maximum Input Spot Size: 12mm
Working Distance: 30mm
Applicable Lasers: Picosecond/Femtosecond lasers with PSO module and Burst mode

Installation and Debugging:

Installation: Fix vertically with M6 screws, ensuring it is firmly locked with the processing surface for stable cutting.
Debugging: Conduct coaxial and concentric calibration (using special tools) to ensure the accuracy of the optical path. Professional operation is recommended.

Maintenance Suggestions:

Cleaning: Wipe the upper and lower protective lenses unidirectionally with alcohol once a week to remove impurities.
Replacement: Replace the vulnerable lenses in a timely manner when they are damaged to ensure the cutting quality.

Application Scenarios:
Precision material processing (such as glass, FPC/PCB, etc.), enabling efficient cutting of complex curves and thick materials.